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SMT Service (Surface-mount technology)

Surface Mount Technology is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs).  An electronic device so made is called a "surface-mount device (SMD)".
Technical Capabilities
Supported Capabilities

Type of machine

Print Screen

  • ESSEMTEC SP-003ML x1
  • EKRA MATS40A x1
  • MPM UP2000-HiE x1

Pick & Place

  • JUKI-Chip Shooter KE730 x 2
  • JUKI-Flexible Mounter KE740 x 1
  • JUKI-Flexible Mounter KE-2060 x 2

Reflow

  • HELLER 1809EXL x3

Placement speed

  • Chip :12,500CPH
  • IC :3,290CPH

Board size

  • Smallest size: 330 x 250 mm
  • Largest size: 410 x 360 mm

Board shape

  • Rectangular
  • Round,
  • Slots,
  • Cutouts,
  • Complex,
  • Irregular

Board type

  • Rigid
  • Flexible
  • Rigid-flexible

Solder Type

  • Leaded and Lead-Free
  • Water soluble solder paste
  • Manual soldering for special parts, e.g. wires and temperature sensitive parts.







SMT Process

Testing Procedures

We perform multiple quality assurance procedures before shipping out any board. These include:

  • AOI (Automated Optical Inspector) SAKI BF 18D N40 x2
  • Functional test (test modules need to be supplied)
  • ICT (in-circuit test)